技术参数

• Package / Case 153-WFBGA
• Mounting Type Surface Mount
• Memory Size 4Tbit
• Memory Type Non-Volatile
• Operating Temperature -25°C ~ 85°C
• Voltage - Supply 2.4V ~ 2.7V
• Technology FLASH - NAND (TLC)
• Clock Frequency 2.32 GHz
• Memory Format FLASH
• Supplier Device Package 153-WFBGA (11.5x13)
• Memory Interface UFS 4.0
• Memory Organization 512G x 8
• ECCN 3A991A2
• HTSUS 8542.32.0071
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant