技术参数

• Package / Case 153-TFBGA
• Mounting Type Surface Mount
• Memory Size 256Gbit
• Memory Type Non-Volatile
• Operating Temperature -40°C ~ 85°C (TA)
• Voltage - Supply 2.7V ~ 3.6V
• Technology FLASH - NAND (TLC)
• Clock Frequency 200 MHz
• Memory Format FLASH
• Supplier Device Package 153-FBGA (11.5x13)
• Memory Interface eMMC_5.1
• Memory Organization 32G x 8
• ECCN 3A991B1A
• HTSUS 8542.32.0071
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant