技术参数

• Package / Case 760-BFBGA, FCBGA
• Speed 750MHz, 800MHz
• Number of I/O 215
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
• Connectivity CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
• Peripherals DMA, POR, PWM, WDT
• Supplier Device Package 760-FCBGA (23x23)
• Architecture DSP, MPU
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant