技术参数

• Package / Case 64-LFBGA
• Mounting Type Surface Mount
• Speed 200MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 256K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 8K x 8
• Core Processor ARM® Cortex®-M33
• Data Converters A/D 11x12b SAR; D/A 2x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
• Peripherals Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
• Supplier Device Package 64-LFBGA (6x6)
• Number of I/O 45
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant