技术参数

• Package / Case 64-WFBGA
• Speed 48MHz
• RAM Size 256KB
• Number of I/O 50
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-M4F
• Connectivity I2C, SPI, UART/USART
• Peripherals Brown-out Detect/Reset, POR, WDT
• Supplier Device Package 64-BGA (4.5x4.5)
• Architecture MCU
• Flash Size 1MB
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)