技术参数

• Package / Case 376-BBGA Exposed Pad
• Mounting Type Surface Mount
• Interface EBI/EMI, HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC
• Type Fixed Point
• Operating Temperature 0°C ~ 90°C (TJ)
• Non-Volatile Memory ROM (64kB)
• On-Chip RAM 240kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.05V, 1.20V
• Clock Rate 700MHz
• Supplier Device Package 376-BGA (23x23)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant