技术参数

• Package / Case 208-TFBGA
• Mounting Type Surface Mount
• Speed 300MHz
• Program Memory Size 8MB (8M x 8)
• RAM Size 1M x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M7
• Data Converters A/D 36x12b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.75V ~ 3.63V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
• Peripherals Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
• Supplier Device Package 208-TFBGA (15x15)
• Number of I/O 157
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant