技术参数

• Package / Case 1313-BFBGA
• Mounting Type Surface Mount
• Speed 1.6GHz, 1.2GHz, 264MHz
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
• Voltage - I/O 1.8V, 2.5V, 3.3V
• Supplier Device Package 1313-BGA (29x29)
• Ethernet 1Gbps (2)
• USB USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
• Number of Cores/Bus Width 8 Core, 64-Bit
• Co-Processors/DSP Multimedia; NEON
• RAM Controllers LPDDR4
• Graphics Acceleration Yes
• Display & Interface Controllers DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
• Security Features A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
• Additional Interfaces CANbus, I2C, SPI, UART
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant