技术参数

• Package / Case 784-FBGA
• Speed 166MHz
• RAM Size 64KB
• Number of I/O 395
• Operating Temperature 0°C ~ 85°C (TJ)
• Core Processor ARM® Cortex®-M3
• Primary Attributes FPGA - 60K Logic Modules
• Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals DDR, PCIe, SERDES
• Supplier Device Package 784-VFBGA (23x23)
• Architecture MCU, FPGA
• Flash Size 256KB
• ECCN 3A991D
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant