技术参数

• Package / Case Die
• Output Type Rail-to-Rail
• Mounting Type Surface Mount
• Amplifier Type CMOS
• Operating Temperature -55°C ~ 125°C
• Slew Rate 1.3V/µs
• Gain Bandwidth Product 1.25 MHz
• Current - Input Bias 25 pA
• Supplier Device Package Die
• Number of Circuits 2
• Current - Output / Channel 30 mA
• Voltage - Supply Span (Min) 3 V
• Voltage - Supply Span (Max) 15.5 V
• ECCN EAR99
• HTSUS 8542.33.0001
• RoHS Status ROHS3 Compliant