技术参数

• Package / Case 737-BFBGA Exposed Pad, FCBGA
• Mounting Type Surface Mount
• Interface Host Interface, I2C, McBSP, PCI, UTOPIA
• Type Fixed Point
• Operating Temperature -40°C ~ 100°C (TJ)
• Non-Volatile Memory 768kB
• On-Chip RAM 32kB
• Voltage - I/O 1.8V, 3V
• Voltage - Core 1V
• Clock Rate 500MHz
• Supplier Device Package 737-FCBGA (24x24)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• RoHS Status ROHS3 Compliant