技术参数

• Package / Case 64-VFQFN Exposed Pad
• Speed 138MHz
• RAM Size 128KB
• Number of I/O 16
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-M3
• Connectivity CSI, I2C, UART
• Peripherals PWM
• Supplier Device Package 64-HVQFN (9x9)
• Architecture DSP, MCU
• ECCN 5A002A REN
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant