技术参数

• Package / Case 100-TFBGA
• Mounting Type Surface Mount
• Speed 550MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 560K x 8
• Operating Temperature -40°C ~ 125°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M7
• Data Converters A/D 17x12b, 26x16b; D/A 2x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
• Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Supplier Device Package 100-TFBGA (8x8)
• Number of I/O 74
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant