技术参数

• Package / Case 25-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 32MHz
• Program Memory Size 32KB (32K x 8)
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• EEPROM Size 1K x 8
• Core Processor ARM® Cortex®-M0+
• Data Converters A/D 10x12b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V
• Connectivity I2C, IrDA, LINbus, MMC/SD, SMBus, SPI, UART/USART
• Peripherals AES, Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Supplier Device Package 25-WLCSP (2.1x2.49)
• Number of I/O 20
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant