技术参数

• Package / Case 33-XFBGA, WLCSP
• Mounting Type Surface Mount
• Memory Size 256Mbit
• Memory Type Non-Volatile
• Operating Temperature 0°C ~ 70°C (TA)
• Voltage - Supply 1.7V ~ 2V
• Technology FLASH - NOR (SLC)
• Clock Frequency 80 MHz
• Memory Format FLASH
• Supplier Device Package 33-WLCSP (3.36x3.97)
• Write Cycle Time - Word, Page 2.3ms
• Memory Interface SPI - Quad I/O, QPI
• Access Time 6 ns
• Memory Organization 32M x 8
• ECCN 3A991B1A
• HTSUS 8542.32.0071
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant