- 产品型号 XC3SD3400A-4FGG676C
- 品牌 Xilinx (AMD)
- RoHS Yes
- 描述 IC FPGA 469 I/O 676FBGA
- 分类 FPGA（现场可编程门阵列）
-
PDF
- 库存 1766
技术参数
- Package / Case 676-BGA
- Mounting Type Surface Mount
- Number of Gates 3400000
- Operating Temperature 0°C ~ 85°C (TJ)
- Voltage - Supply 1.14V ~ 1.26V
- Number of Logic Elements/Cells 53712
- Supplier Device Package 676-FBGA (27x27)
- Number of LABs/CLBs 5968
- Total RAM Bits 2322432
- Number of I/O 469
- DigiKey Programmable Not Verified
- ECCN 3A991D
- HTSUS 8542.39.0001
- Moisture Sensitivity Level (MSL) 3 (168 Hours)
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
相关产品
IC FPGA 190 I/O 256FTBGA
库存: 12581
IC FPGA 68 I/O 100VQFP
库存: 20942
IC FPGA 309 I/O 484CSBGA
库存: 1500
IC FPGA 210 I/O 324CSBGA
库存: 1897
IC FPGA 400 I/O 676FPBGA
库存: 1515
