技术参数

• Package / Case 25-SSIP Formed Leads
• Mounting Type Through Hole
• Function Driver - Fully Integrated, Control and Power Stage
• Current - Output 4.5A
• Interface PWM, Serial
• Operating Temperature -20°C ~ 85°C (TA)
• Output Configuration Half Bridge (2)
• Voltage - Supply 10V ~ 27V
• Applications General Purpose
• Technology Bi-CMOS
• Voltage - Load 10V ~ 27V
• Supplier Device Package 25-HZIP
• Motor Type - AC, DC Brushed DC
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)