技术参数

• Connector Type SO-DIMM-200
• Size / Dimension 0.220" L x 0.118" W (5.60mm x 3.00mm)
• RAM Size 1GB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type FPGA
• Core Processor ARM® Cortex®-A9
• Co-Processor Zynq-7000 (Z-7020)
• Flash Size 64MB, 512MB (NAND)
• ECCN 3A991D
• HTSUS 8471.50.0150
• REACH Status Vendor Undefined