技术参数

• Package / Case 24-SSIP Exposed Pad, Formed Leads
• Mounting Type Through Hole
• Function Driver
• Current - Output 2.5A
• Interface Logic
• Operating Temperature 150°C (TJ)
• Output Configuration Half Bridge (3)
• Voltage - Supply 13.5V ~ 16.5V
• Applications Home Appliance
• Technology Power MOSFET
• Voltage - Load 500V (Max)
• Supplier Device Package 24-ZIP
• Motor Type - AC, DC Brushless DC (BLDC)