技术参数

• Package / Case 225-LFBGA
• Mounting Type Surface Mount
• Speed 300MHz, 400MHz
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-R52
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 225-FBGA (13x13)
• Ethernet 10/100/1000Mbps (1)
• USB USB 2.0 (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Multimedia; NEON™ SIMD
• Graphics Acceleration No
• Additional Interfaces CANbus, I2C, SCI, SPI, WDT
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant