技术参数

• Package / Case 556-TFBGA
• Mounting Type Surface Mount
• Memory Size 32Gbit
• Memory Type Volatile
• Operating Temperature -25°C ~ 85°C (TC)
• Voltage - Supply 1.06V ~ 1.17V
• Technology SDRAM - Mobile LPDDR4
• Clock Frequency 2.133 GHz
• Memory Format DRAM
• Supplier Device Package 556-WFBGA (12.4x12.4)
• Write Cycle Time - Word, Page 18ns
• Memory Interface Parallel
• Access Time 3.5 ns
• Memory Organization 512M x 64
• DigiKey Programmable Not Verified
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant