技术参数

• Package / Case 153-TFBGA
• Mounting Type Surface Mount
• Memory Size 512Gbit
• Memory Type Non-Volatile
• Operating Temperature -25°C ~ 85°C
• Technology FLASH - NAND (TLC)
• Memory Format FLASH
• Supplier Device Package 153-BGA (11.5x13)
• Memory Interface eMMC
• Memory Organization 64G x 8
• DigiKey Programmable Not Verified
• ECCN 3A991B1A
• HTSUS 8542.32.0071
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status ROHS3 Compliant