技术参数

• Package / Case 456-LFBGA
• Mounting Type Surface Mount
• Speed 200MHz, 1.2GHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-A55, ARM® Cortex®-M33
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 456-LFBGA (15x15)
• Ethernet 10/100/1000Mbps (2)
• USB USB 2.0 (2)
• Number of Cores/Bus Width 3 Core, 64-Bit
• Co-Processors/DSP ARM® Mali-G31, Multimedia; NEON™ SIMD
• RAM Controllers DDR3L, DDR4
• Graphics Acceleration Yes
• Display & Interface Controllers LCD, MIPI/CSI, MIPI/DSI
• Additional Interfaces CANbus, eMMC/SD/SDIO, I2C, SPI, UART
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant