技术参数

• Connector Type Board-to-Board (BTB) Socket
• Size / Dimension 2.050" L x 2.990" W (52.00mm x 76.00mm)
• RAM Size 2GB
• Operating Temperature 0°C ~ 85°C
• Module/Board Type FPGA Core
• Core Processor Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
• Flash Size 128MB
• California Prop 65 California Prop 65 Information
• ECCN 5A002A TRE
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• RoHS Status ROHS3 Compliant