技术参数

• Package / Case 1760-BBGA, FCBGA
• Speed 533MHz, 1.333GHz
• RAM Size 256KB
• Number of I/O 622
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
• Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DDR, DMA, PCIe
• Supplier Device Package 1760-FCBGA (42.5x42.5)
• Architecture MCU, FPGA
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• RoHS Status ROHS3 Compliant