技术参数

• Package / Case 10-WFDFN Exposed Pad
• Mounting Type Surface Mount
• Interface I2C, Logic, SPI
• Operating Temperature -40°C ~ 150°C (TJ)
• Output Configuration Half Bridge
• Voltage - Supply 8V ~ 36V
• Rds On (Typ) 1Ohm LS, 1.8Ohm HS
• Applications General Purpose
• Current - Output / Channel 300mA
• Current - Peak Output 300mA
• Voltage - Load 8V ~ 36V
• Supplier Device Package 10-TDFN (3x3)
• Fault Protection Current Limiting, Over Current, Over Temperature, Shoot-Through, UVLO
• Load Type Inductive, Capacitive, Resistive
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant