• 库存 1500

技术参数

  • Connector Type B2B
  • Size / Dimension 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • RAM Size 512MB
  • Operating Temperature -40°C ~ 85°C
  • Module/Board Type MCU, FPGA
  • Core Processor ARM Cortex-A9
  • Co-Processor Zynq-7000 (Z-7020)
  • Flash Size 32MB
  • California Prop 65 California Prop 65 Information
  • ECCN 3A991D
  • HTSUS 8471.50.0150
  • Moisture Sensitivity Level (MSL) Not Applicable
  • RoHS Status ROHS3 Compliant
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