技术参数

• Package / Case 8-VDFN Exposed Pad
• Mounting Type Surface Mount, Wettable Flank
• Type LIN System Basis Chip
• Supplier Device Package 8-VDFN (3x3)
• Grade Automotive
• DigiKey Programmable Not Verified
• Qualification AEC-Q100
• ECCN EAR99
• HTSUS 8542.39.0001
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant