技术参数

• Package / Case 272-BBGA
• Mounting Type Surface Mount
• Interface DMA, Host Interface, I²C, McASP, McBSP
• Type Floating Point
• Operating Temperature -55°C ~ 105°C (TC)
• Non-Volatile Memory External
• On-Chip RAM 264kB
• Voltage - I/O 3.30V
• Voltage - Core 1.26V
• Clock Rate 200MHz
• Supplier Device Package 272-BGA (27x27)
• ECCN 3A991A2
• HTSUS 8542.31.0001