技术参数

• Features Break-Before-Make, USB 2.0
• Package / Case 10-UFQFN Exposed Pad
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• Applications USB
• On-State Resistance (Max) 4.8Ohm (USB), 6Ohm (MHL)
• -3db Bandwidth 2.46GHz
• Supplier Device Package 10-MicroPak™
• Voltage - Supply, Single (V+) 2.7V ~ 4.3V
• Switch Circuit DPDT
• ECCN EAR99
• HTSUS 8542.39.0001