技术参数

• Package / Case 20-VFDFN Exposed Pad
• Mounting Type Surface Mount
• Interface CAN, SPI
• Voltage - Supply 3V ~ 28V
• Applications System Basis Chip
• Supplier Device Package 20-HVSON (3.5x5.5)
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant