技术参数

• Package / Case 256-LFBGA
• Mounting Type Surface Mount
• Speed 528MHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-A9
• Supplier Device Package 256-LFBGA (11x11)
• USB USB 2.0 (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Multimedia; NEON™ MPE
• Graphics Acceleration Yes
• Display & Interface Controllers LCD, LVDS, MIPICSI2, Video
• Security Features AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
• Additional Interfaces CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant