技术参数

• Package / Case 179-LFBGA
• Mounting Type Surface Mount
• Interface Host Interface, I2C, McBSP
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (64kB)
• On-Chip RAM 256kB
• Voltage - I/O 3V, 3.3V
• Voltage - Core 1.60V
• Clock Rate 200MHz
• Supplier Device Package 179-NFBGA (12x12)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant