技术参数

• Package / Case 16-SOIC (0.173", 4.40mm Width)
• Mounting Type Surface Mount
• Function Driver - Fully Integrated, Control and Power Stage
• Current - Output 340mA
• Interface Parallel
• Operating Temperature -55°C ~ 150°C (TJ)
• Output Configuration Half Bridge (3)
• Voltage - Supply 10V ~ 20V
• Applications General Purpose
• Technology CMOS
• Supplier Device Package 16-MFP
• Motor Type - AC, DC Brushless DC (BLDC)
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status Not applicable