技术参数

• Package / Case 529-BFBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, HPI, I2C, McASP, PCI, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory ROM (8kB)
• On-Chip RAM 248kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.05V, 1.20V
• Clock Rate 594MHz DSP, 297MHz ARM®
• Supplier Device Package 529-FCBGA (19x19)
• ECCN 3A991A2
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status Not applicable