技术参数

• Package / Case 256-LBGA Exposed Pad
• Mounting Type Surface Mount
• Interface DAI, DPI
• Type Floating Point
• Operating Temperature -40°C ~ 85°C (TA)
• Non-Volatile Memory ROM (768kB)
• On-Chip RAM 256kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 333MHz
• Supplier Device Package 256-BGA-ED (27x27)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant