技术参数

• Package / Case 225-LFBGA
• Mounting Type Surface Mount
• Speed 140MHz
• RAM Size 128K x 8
• Operating Temperature -20°C ~ 70°C (TA)
• Oscillator Type External
• Program Memory Type ROMless
• Core Processor Coldfire V2
• Data Converters A/D 6x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.08V ~ 3.6V
• Connectivity ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
• Peripherals DMA
• Supplier Device Package 225-MAPBGA (13x13)
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant