技术参数

• Package / Case 304-LBGA Exposed Pad
• Mounting Type Surface Mount
• Speed 75MHz
• Operating Temperature 0°C ~ 70°C (TA)
• Core Processor 68060
• Voltage - I/O 3.3V
• Supplier Device Package 304-TBGA (31x31)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Graphics Acceleration No
• Additional Interfaces SCI, SPI
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant