技术参数

• Package / Case 337-LFBGA
• Mounting Type Surface Mount
• Speed 300MHz
• Program Memory Size 4MB (4M x 8)
• RAM Size 512K x 8
• Operating Temperature -55°C ~ 125°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 128K x 8
• Core Processor ARM® Cortex®-R5F
• Data Converters A/D 41x12b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V
• Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
• Peripherals DMA, POR, PWM, WDT
• Supplier Device Package 337-NFBGA (16x16)
• Number of I/O 145
• DigiKey Programmable Not Verified
• ECCN 3A001A2C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Affected
• RoHS Status ROHS3 Compliant