技术参数

• Features Bootstrap Circuit, Diode Emulation
• Package / Case PowerPAK® MLP55-31L
• Mounting Type Surface Mount
• Interface Logic, PWM
• Operating Temperature -40°C ~ 150°C (TJ)
• Output Configuration Half Bridge
• Voltage - Supply 4.5V ~ 5.5V
• Applications General Purpose
• Current - Output / Channel 50A
• Current - Peak Output 100A
• Technology Power MOSFET
• Voltage - Load 24V
• Supplier Device Package PowerPAK® MLP55-31L
• Fault Protection Over Current, Over Temperature, Shoot-Through, UVLO
• Load Type Inductive, Capacitive, Resistive
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)