技术参数

• Features Break-Before-Make, USB 2.0
• Package / Case 9-UFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• Applications USB
• On-State Resistance (Max) 5Ohm
• -3db Bandwidth 1GHz
• Supplier Device Package 9-WLCSP (1.2x1.2)
• Voltage - Supply, Single (V+) 2.7V ~ 5.5V
• Switch Circuit DPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Number of Channels 2
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant