技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Interface I2C, SPI
• Configuration 128 Segment
• Operating Temperature -30°C ~ 80°C (TA)
• Voltage - Supply 1.6V ~ 3.6V
• Supplier Device Package Chip
• Current - Supply 30 µA
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant