• In Stock 1770

Technical Details

  • Package / Case 256-BGA
  • Mounting Type Surface Mount
  • Interface EBI/EMI, HPI, I2C, McASP, SPI
  • Type Floating Point
  • Operating Temperature -55°C ~ 125°C (TC)
  • Non-Volatile Memory ROM (384kB)
  • On-Chip RAM 288kB
  • Voltage - I/O 3.30V
  • Voltage - Core 1.20V
  • Clock Rate 250MHz
  • Supplier Device Package 256-BGA (17x17)
  • ECCN 3A001A2C
  • HTSUS 8542.31.0001
  • Moisture Sensitivity Level (MSL) 3 (168 Hours)
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

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