Technical Details

• Connector Type Board-to-Board (BTB) Socket
• Size / Dimension 2.047" L x 2.992" W (52.00mm x 76.00mm)
• RAM Size 1GB
• Operating Temperature 0°C ~ 70°C
• Module/Board Type FPGA
• Core Processor ARM® Cortex®-A9
• Co-Processor Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
• Flash Size 64MB
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• RoHS Status ROHS3 Compliant