Technical Details

• Package / Case 770-BFBGA, FCBGA
• Speed 2GHz, 1GHz, 1GHz
• RAM Size 1.5MB
• Number of I/O 155
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
• Connectivity MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
• Peripherals DMA, PWM, WDT
• Supplier Device Package 770-FCBGA (23x23)
• Architecture DSP, MCU, MPU
• Grade Automotive
• Qualification AEC-Q100
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant